An efficient leakage-aware thermal simulation approach for 3D-ICs using corrected linearized model and algebraic multigrid

Chao Yan, Hengliang Zhu, Dian Zhou, Xuan Zeng. An efficient leakage-aware thermal simulation approach for 3D-ICs using corrected linearized model and algebraic multigrid. In David Atienza, Giorgio Di Natale, editors, Design, Automation & Test in Europe Conference & Exhibition, DATE 2017, Lausanne, Switzerland, March 27-31, 2017. pages 1207-1212, IEEE, 2017. [doi]

Abstract

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