Numerical modeling of warpage induced in QFN array molding process

D. G. Yang, K. M. B. Jansen, L. J. Ernst, G. Q. Zhang, W. D. van Driel, H. J. L. Bressers, J. H. J. Janssen. Numerical modeling of warpage induced in QFN array molding process. Microelectronics Reliability, 47(2-3):310-318, 2007. [doi]

Authors

D. G. Yang

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K. M. B. Jansen

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L. J. Ernst

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G. Q. Zhang

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W. D. van Driel

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H. J. L. Bressers

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J. H. J. Janssen

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