D. G. Yang, K. M. B. Jansen, L. J. Ernst, G. Q. Zhang, W. D. van Driel, H. J. L. Bressers, J. H. J. Janssen. Numerical modeling of warpage induced in QFN array molding process. Microelectronics Reliability, 47(2-3):310-318, 2007. [doi]
@article{YangJEZDBJ07,
title = {Numerical modeling of warpage induced in QFN array molding process},
author = {D. G. Yang and K. M. B. Jansen and L. J. Ernst and G. Q. Zhang and W. D. van Driel and H. J. L. Bressers and J. H. J. Janssen},
year = {2007},
doi = {10.1016/j.microrel.2006.09.036},
url = {http://dx.doi.org/10.1016/j.microrel.2006.09.036},
tags = {modeling, process modeling},
researchr = {https://researchr.org/publication/YangJEZDBJ07},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {47},
number = {2-3},
pages = {310-318},
}