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D. G. Yang, K. M. B. Jansen, L. J. Ernst, G. Q. Zhang, W. D. van Driel, H. J. L. Bressers, J. H. J. Janssen. Numerical modeling of warpage induced in QFN array molding process. Microelectronics Reliability, 47(2-3):310-318, 2007. [doi]