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Reliability modeling on a MOSFET power package based on embedded die technology

Daoguo Yang, Martien Kengen, W. G. M. Peels, David Heyes, W. D. van Driel. Reliability modeling on a MOSFET power package based on embedded die technology. Microelectronics Reliability, 50(7):923-927, 2010. [doi]

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Daoguo Yang

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Martien Kengen

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W. G. M. Peels

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David Heyes

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W. D. van Driel

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