Daoguo Yang, Martien Kengen, W. G. M. Peels, David Heyes, W. D. van Driel. Reliability modeling on a MOSFET power package based on embedded die technology. Microelectronics Reliability, 50(7):923-927, 2010. [doi]
@article{YangKPHD10,
title = {Reliability modeling on a MOSFET power package based on embedded die technology},
author = {Daoguo Yang and Martien Kengen and W. G. M. Peels and David Heyes and W. D. van Driel},
year = {2010},
doi = {10.1016/j.microrel.2010.02.026},
url = {http://dx.doi.org/10.1016/j.microrel.2010.02.026},
tags = {rule-based, modeling, reliability},
researchr = {https://researchr.org/publication/YangKPHD10},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {50},
number = {7},
pages = {923-927},
}