Reliability modeling on a MOSFET power package based on embedded die technology

Daoguo Yang, Martien Kengen, W. G. M. Peels, David Heyes, W. D. van Driel. Reliability modeling on a MOSFET power package based on embedded die technology. Microelectronics Reliability, 50(7):923-927, 2010. [doi]

Abstract

Abstract is missing.