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IDDA-3D: Inter-Die Delay Aware Timing-Driven Placement on Face-to-Face Bonded 3D ICs

Zixian Yang, Shanyi Li, Leilei Jin, Tsung-Yi Ho, Chien-Nan Jimmy Liu. IDDA-3D: Inter-Die Delay Aware Timing-Driven Placement on Face-to-Face Bonded 3D ICs. In Stephan Held, Rickard Ewetz, Tung-Chieh Chen, Gracieli Posser, editors, Proceedings of the 2026 International Symposium on Physical Design, ISPD 2026, BonnGermany, March 15-18, 2026. pages 11-19, ACM, 2026. [doi]

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