Kang Yang, Suhui Yang, Yan Ouyang, Shengwei Yang, Kun Han, Yi He. Stress Migration of Aluminum Backside Interconnect in Xtacking®. In IEEE International Reliability Physics Symposium, IRPS 2023, Monterey, CA, USA, March 26-30, 2023. pages 1-4, IEEE, 2023. [doi]
Abstract is missing.