The Effect of Cu Orientation on Fracture Location in Cu3Sn-Cu Interface Structure Under Monotonic Loading Condition by Molecular Dynamics Simulation - researchr publication authors

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Jian Yang, Jicheng Zhang, Lihua Liang. The Effect of Cu Orientation on Fracture Location in Cu3Sn-Cu Interface Structure Under Monotonic Loading Condition by Molecular Dynamics Simulation. In 13th IEEE Annual International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2018, Singapore, Singapore, April 22-26, 2018. pages 460-464, IEEE, 2018. [doi]

This author has not been identified. Look up 'Jian Yang' in GoogleThis author has not been identified. Look up 'Jicheng Zhang' in GoogleThis author has not been identified. Look up 'Lihua Liang' in Google

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