Jian Yang, Jicheng Zhang, Lihua Liang. The Effect of Cu Orientation on Fracture Location in Cu3Sn-Cu Interface Structure Under Monotonic Loading Condition by Molecular Dynamics Simulation. In 13th IEEE Annual International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2018, Singapore, Singapore, April 22-26, 2018. pages 460-464, IEEE, 2018. [doi]
@inproceedings{YangZL18-7,
title = {The Effect of Cu Orientation on Fracture Location in Cu3Sn-Cu Interface Structure Under Monotonic Loading Condition by Molecular Dynamics Simulation},
author = {Jian Yang and Jicheng Zhang and Lihua Liang},
year = {2018},
doi = {10.1109/NEMS.2018.8556965},
url = {https://doi.org/10.1109/NEMS.2018.8556965},
researchr = {https://researchr.org/publication/YangZL18-7},
cites = {0},
citedby = {0},
pages = {460-464},
booktitle = {13th IEEE Annual International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2018, Singapore, Singapore, April 22-26, 2018},
publisher = {IEEE},
isbn = {978-1-5386-5273-2},
}