The Effect of Cu Orientation on Fracture Location in Cu3Sn-Cu Interface Structure Under Monotonic Loading Condition by Molecular Dynamics Simulation

Jian Yang, Jicheng Zhang, Lihua Liang. The Effect of Cu Orientation on Fracture Location in Cu3Sn-Cu Interface Structure Under Monotonic Loading Condition by Molecular Dynamics Simulation. In 13th IEEE Annual International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2018, Singapore, Singapore, April 22-26, 2018. pages 460-464, IEEE, 2018. [doi]

Abstract

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