Optimizing the fine-pitch copper wire bonding process with multiple quality characteristics using a grey-fuzzy Taguchi method

Jun-Hsien Yeh, Tsung-Nan Tsai. Optimizing the fine-pitch copper wire bonding process with multiple quality characteristics using a grey-fuzzy Taguchi method. Microelectronics Reliability, 54(1):287-296, 2014. [doi]

Authors

Jun-Hsien Yeh

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Tsung-Nan Tsai

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