Optimizing the fine-pitch copper wire bonding process with multiple quality characteristics using a grey-fuzzy Taguchi method

Jun-Hsien Yeh, Tsung-Nan Tsai. Optimizing the fine-pitch copper wire bonding process with multiple quality characteristics using a grey-fuzzy Taguchi method. Microelectronics Reliability, 54(1):287-296, 2014. [doi]

Abstract

Abstract is missing.