The following publications are possibly variants of this publication:
- A hybrid intelligent approach for optimizing the fine-pitch copper wire bonding process with multiple quality characteristics in IC assemblyTsung-Nan Tsai. jim, 25(1):177-192, 2014. [doi]
- Optimization of the Cu wire bonding process for IC assembly using Taguchi methodsChao-Ton Su, Cheng-Jung Yeh. mr, 51(1):53-59, 2011. [doi]
- Optimal Parameter Design for IC Wire Bonding Process by Using Fuzzy Logic and Taguchi MethodJinn-Tsong Tsai, Cheng-Chung Chang, Wen-Ping Chen, Jyh-Horng Chou. access, 4:3034-3045, 2016. [doi]