Il-Min Yi, Seung-Jun Bae, Young-Soo Sohn, Jae-Yoon Sim, Hong June Park. An on-chip TSV emulation using metal bar surrounded by metal ring to develop interface circuits. In International SoC Design Conference, ISOCC 2012, Jeju Island, South Korea, November 4-7, 2012. pages 192-195, IEEE, 2012. [doi]
Abstract is missing.