Liang Yin, Cheng-Po Chen, Christopher Kapusta, Reza Ghandi. Electronic packaging of SiC MOSFET-based devices for reliable high temperature operation. In 2015 IEEE International Symposium on Circuits and Systems, ISCAS 2015, Lisbon, Portugal, May 24-27, 2015. pages 1170-1173, IEEE, 2015. [doi]
Abstract is missing.