Younwoo Yoo, Hayoung Lee, Seung-Ho Shin, Sungho Kang. Post-bond Repair of Line Faults with Double-bit ECC for 3D Memory. In 18th International SoC Design Conference, ISOCC 2021, Jeju Island, South Korea, Republic of, October 6-9, 2021. pages 427-428, IEEE, 2021. [doi]
@inproceedings{YooLSK21,
title = {Post-bond Repair of Line Faults with Double-bit ECC for 3D Memory},
author = {Younwoo Yoo and Hayoung Lee and Seung-Ho Shin and Sungho Kang},
year = {2021},
doi = {10.1109/ISOCC53507.2021.9613892},
url = {https://doi.org/10.1109/ISOCC53507.2021.9613892},
researchr = {https://researchr.org/publication/YooLSK21},
cites = {0},
citedby = {0},
pages = {427-428},
booktitle = {18th International SoC Design Conference, ISOCC 2021, Jeju Island, South Korea, Republic of, October 6-9, 2021},
publisher = {IEEE},
isbn = {978-1-6654-0174-6},
}