Younwoo Yoo, Hayoung Lee, Seung-Ho Shin, Sungho Kang. Post-bond Repair of Line Faults with Double-bit ECC for 3D Memory. In 18th International SoC Design Conference, ISOCC 2021, Jeju Island, South Korea, Republic of, October 6-9, 2021. pages 427-428, IEEE, 2021. [doi]
Abstract is missing.