Seung Wook Yoon, Dae Wook Yang, Jae Hoon Koo, Meenakshi Padmanathan, Flynn Carson. 3D TSV processes and its assembly/packaging technology. In IEEE International Conference on 3D System Integration, 3DIC 2009, San Francisco, California, USA, 28-30 September 2009. pages 1-5, IEEE, 2009. [doi]
Abstract is missing.