Hiroshi Yoshikawa, Atsuko Kawasaki, Tomoaki, Iiduka, Yasushi Nishimura, Kazumasa Tanida, Kazutaka Akiyama, Masahiro Sekiguchi, Mie Matsuo, Satoru Fukuchi, Katsutomu Takahashi. Chip Scale Camera Module (CSCM) using Through-Silicon-Via (TSV). In IEEE International Solid-State Circuits Conference, ISSCC 2009, Digest of Technical Papers, San Francisco, CA, USA, 8-12 February, 2009. pages 476-477, IEEE, 2009. [doi]
Abstract is missing.