11.1 A 1.7pJ/b 112Gb/s XSR Transceiver for Intra-Package Communication in 7nm FinFET Technology

Ramy Yousry, E.-Hung Chen, Yu-Ming Ying, Mohammed Abdullatif, Mohammad Elbadry, Ahmed ElShater, Tsz-Bin Liu, Joonyeong Lee, Dhinessh Ramachandran, Kaiz Wang, Chih-Hao Weng, Mau-Lin Wu, Tamer Ali. 11.1 A 1.7pJ/b 112Gb/s XSR Transceiver for Intra-Package Communication in 7nm FinFET Technology. In IEEE International Solid-State Circuits Conference, ISSCC 2021, San Francisco, CA, USA, February 13-22, 2021. pages 180-182, IEEE, 2021. [doi]

Abstract

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