Abdul Hamid Bin Yousuf, Nahid M. Hossain, Masud H. Chowdhury. Impacts of different shapes of through-silicon-via core on 3D IC performance. In IEEE International Symposium on Circuits and Systems, ISCAS 2017, Baltimore, MD, USA, May 28-31, 2017. pages 1-4, IEEE, 2017. [doi]
@inproceedings{YousufHC17,
title = {Impacts of different shapes of through-silicon-via core on 3D IC performance},
author = {Abdul Hamid Bin Yousuf and Nahid M. Hossain and Masud H. Chowdhury},
year = {2017},
doi = {10.1109/ISCAS.2017.8050434},
url = {https://doi.org/10.1109/ISCAS.2017.8050434},
researchr = {https://researchr.org/publication/YousufHC17},
cites = {0},
citedby = {0},
pages = {1-4},
booktitle = {IEEE International Symposium on Circuits and Systems, ISCAS 2017, Baltimore, MD, USA, May 28-31, 2017},
publisher = {IEEE},
isbn = {978-1-4673-6853-7},
}