A Post-Bond TSV Test Method Based on RGC Parameters Measurement

Yang Yu, Xu Fang, Xiyuan Peng. A Post-Bond TSV Test Method Based on RGC Parameters Measurement. IEEE Trans. on CAD of Integrated Circuits and Systems, 39(2):506-519, 2020. [doi]

Authors

Yang Yu

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Xu Fang

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Xiyuan Peng

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