Yang Yu, Xu Fang, Xiyuan Peng. A Post-Bond TSV Test Method Based on RGC Parameters Measurement. IEEE Trans. on CAD of Integrated Circuits and Systems, 39(2):506-519, 2020. [doi]
@article{YuFP20,
title = {A Post-Bond TSV Test Method Based on RGC Parameters Measurement},
author = {Yang Yu and Xu Fang and Xiyuan Peng},
year = {2020},
doi = {10.1109/TCAD.2018.2887051},
url = {https://doi.org/10.1109/TCAD.2018.2887051},
researchr = {https://researchr.org/publication/YuFP20},
cites = {0},
citedby = {0},
journal = {IEEE Trans. on CAD of Integrated Circuits and Systems},
volume = {39},
number = {2},
pages = {506-519},
}