Haiyang Yu, C. R. Kao. Formation Mechanism of high Ni content (Cu, Ni)6Sn5 in Cu/Sn/Ni microbump for solid state aging. In 2022 IEEE International Conference on Integrated Circuits, Technologies and Applications, ICTA 2022, Xi'an, China, October 28-30, 2022. pages 20-21, IEEE, 2022. [doi]
Abstract is missing.