Thomas Edison Yu, Tomokazu Yoneda, Krishnendu Chakrabarty, Hideo Fujiwara. Thermal-Safe Test Access Mechanism and Wrapper Co-optimization for System-on-Chip. In 16th Asian Test Symposium, ATS 2007, Beijing, China, October 8-11, 2007. pages 187-192, IEEE, 2007. [doi]
Abstract is missing.