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Electrical characterization of RF TSV for 3D multi-core and heterogeneous ICs

Le Yu, Haigang Yang, Tom T. Jing, Min Xu, Robert Geer, Wei Wang. Electrical characterization of RF TSV for 3D multi-core and heterogeneous ICs. In 2010 International Conference on Computer-Aided Design (ICCAD 10), November 7-11, 2010, San Jose, CA, USA. pages 686-693, IEEE, 2010. [doi]

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Le Yu

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Haigang Yang

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Tom T. Jing

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Min Xu

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Robert Geer

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Wei Wang

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