Electrical characterization of RF TSV for 3D multi-core and heterogeneous ICs

Le Yu, Haigang Yang, Tom T. Jing, Min Xu, Robert Geer, Wei Wang. Electrical characterization of RF TSV for 3D multi-core and heterogeneous ICs. In 2010 International Conference on Computer-Aided Design (ICCAD 10), November 7-11, 2010, San Jose, CA, USA. pages 686-693, IEEE, 2010. [doi]

Abstract

Abstract is missing.