A SOI sandwich differential capacitance accelerometer with low-stress package

Yangxi Zhang, Chengchen Gao, Fanrui Meng, Yilong Hao. A SOI sandwich differential capacitance accelerometer with low-stress package. In 9th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2014, Waikiki Beach, HI, USA, April 13-16, 2014. pages 341-345, IEEE, 2014. [doi]

@inproceedings{ZhangGMH14,
  title = {A SOI sandwich differential capacitance accelerometer with low-stress package},
  author = {Yangxi Zhang and Chengchen Gao and Fanrui Meng and Yilong Hao},
  year = {2014},
  doi = {10.1109/NEMS.2014.6908822},
  url = {https://doi.org/10.1109/NEMS.2014.6908822},
  researchr = {https://researchr.org/publication/ZhangGMH14},
  cites = {0},
  citedby = {0},
  pages = {341-345},
  booktitle = {9th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2014, Waikiki Beach, HI, USA, April 13-16, 2014},
  publisher = {IEEE},
  isbn = {978-1-4799-4726-3},
}