Z. Zhang, M. Kraatz, M. Hauschildt, S. Choi, André Clausner, Ehrenfried Zschech, Martin Gall. Strategy to Characterize Electromigration Short Length Effects in Cu/low-k Interconnects. In IEEE International Reliability Physics Symposium, IRPS 2021, Monterey, CA, USA, March 21-25, 2021. pages 1-5, IEEE, 2021. [doi]
Abstract is missing.