Jie Zhang, Wei Lu, Po-Tsang Huang, Sih-Han Li, Tsung-Yi Hung, Shih-Hsien Wu, Ming-Ji Dai, I-Shan Chung, Wen-Chao Chen, Chin-Hung Wang, Shyh-Shyuan Sheu, Hung-Ming Chen, Kuan-Neng Chen, Wei-Chung Lo, Chih-I Wu. An Embedded Multi-Die Active Bridge (EMAB) Chip for Rapid-Prototype Programmable 2.5D/3D Packaging Technology. In IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits 2022), Honolulu, HI, USA, June 12-17, 2022. pages 262-263, IEEE, 2022. [doi]
@inproceedings{ZhangLHLHWDCCWS22,
title = {An Embedded Multi-Die Active Bridge (EMAB) Chip for Rapid-Prototype Programmable 2.5D/3D Packaging Technology},
author = {Jie Zhang and Wei Lu and Po-Tsang Huang and Sih-Han Li and Tsung-Yi Hung and Shih-Hsien Wu and Ming-Ji Dai and I-Shan Chung and Wen-Chao Chen and Chin-Hung Wang and Shyh-Shyuan Sheu and Hung-Ming Chen and Kuan-Neng Chen and Wei-Chung Lo and Chih-I Wu},
year = {2022},
doi = {10.1109/VLSITechnologyandCir46769.2022.9830188},
url = {https://doi.org/10.1109/VLSITechnologyandCir46769.2022.9830188},
researchr = {https://researchr.org/publication/ZhangLHLHWDCCWS22},
cites = {0},
citedby = {0},
pages = {262-263},
booktitle = {IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits 2022), Honolulu, HI, USA, June 12-17, 2022},
publisher = {IEEE},
isbn = {978-1-6654-9772-5},
}