Integration of 5G and OPC UA for Smart Manufacturing of the Future

Xiongfeng Zhang, Seonjo Lim, Changdae Lee, Won Seok Song, Yu-Chul Kim, Mengmeng Yu, Seung Ho Hong, Namhyun Yoo, Min Wei. Integration of 5G and OPC UA for Smart Manufacturing of the Future. In IEEE/SICE International Symposium on System Integration, SII 2023, Atlanta, GA, USA, January 17-20, 2023. pages 1-6, IEEE, 2023. [doi]

Abstract

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