Jinwei Zhang, Sheriff Sadiqbatcha, Michael O'Dea, Hussam Amrouch, Sheldon X.-D. Tan. Full-Chip Power Density and Thermal Map Characterization for Commercial Microprocessors Under Heat Sink Cooling. IEEE Trans. on CAD of Integrated Circuits and Systems, 41(5):1453-1466, 2022. [doi]
Abstract is missing.