Fast stress analysis for runtime reliability enhancement of 3D IC using artificial neural network - researchr publication authors

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Lang Zhang, Hai Wang, Sheldon X.-D. Tan. Fast stress analysis for runtime reliability enhancement of 3D IC using artificial neural network. In 17th International Symposium on Quality Electronic Design, ISQED 2016, Santa Clara, CA, USA, March 15-16, 2016. pages 173-178, IEEE, 2016. [doi]

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