Lang Zhang, Hai Wang, Sheldon X.-D. Tan. Fast stress analysis for runtime reliability enhancement of 3D IC using artificial neural network. In 17th International Symposium on Quality Electronic Design, ISQED 2016, Santa Clara, CA, USA, March 15-16, 2016. pages 173-178, IEEE, 2016. [doi]
@inproceedings{ZhangWT16-0,
title = {Fast stress analysis for runtime reliability enhancement of 3D IC using artificial neural network},
author = {Lang Zhang and Hai Wang and Sheldon X.-D. Tan},
year = {2016},
doi = {10.1109/ISQED.2016.7479196},
url = {http://dx.doi.org/10.1109/ISQED.2016.7479196},
researchr = {https://researchr.org/publication/ZhangWT16-0},
cites = {0},
citedby = {0},
pages = {173-178},
booktitle = {17th International Symposium on Quality Electronic Design, ISQED 2016, Santa Clara, CA, USA, March 15-16, 2016},
publisher = {IEEE},
isbn = {978-1-5090-1213-8},
}