Dongxu Zhang, Zhenyu Weng, Ya Zhang, Haozheng Dai, Jiageng Wu, Xiaoping Min, Shengxiang Ge. A hot embossing robot for bonding microfluidic chips: design, control and test. In 2019 IEEE International Conference on Real-time Computing and Robotics, RCAR 2019, Irkutsk, Russia, August 4-9, 2019. pages 679-684, IEEE, 2019. [doi]
Abstract is missing.