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Research on a 3D Encapsulation Technique for Capacitive MEMS Sensors Based on Through Silicon Via

Meng Zhang, Jian Yang, Yurong He, Fan Yang, Fuhua Yang, Guowei Han, Chaowei Si, Jin Ning. Research on a 3D Encapsulation Technique for Capacitive MEMS Sensors Based on Through Silicon Via. Sensors, 19(1):93, 2019. [doi]

Authors

Meng Zhang

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Jian Yang

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Yurong He

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Fan Yang

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Fuhua Yang

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Guowei Han

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Chaowei Si

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Jin Ning

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