Meng Zhang, Jian Yang, Yurong He, Fan Yang, Fuhua Yang, Guowei Han, Chaowei Si, Jin Ning. Research on a 3D Encapsulation Technique for Capacitive MEMS Sensors Based on Through Silicon Via. Sensors, 19(1):93, 2019. [doi]
@article{ZhangYHYYHSN19,
title = {Research on a 3D Encapsulation Technique for Capacitive MEMS Sensors Based on Through Silicon Via},
author = {Meng Zhang and Jian Yang and Yurong He and Fan Yang and Fuhua Yang and Guowei Han and Chaowei Si and Jin Ning},
year = {2019},
doi = {10.3390/s19010093},
url = {https://doi.org/10.3390/s19010093},
researchr = {https://researchr.org/publication/ZhangYHYYHSN19},
cites = {0},
citedby = {0},
journal = {Sensors},
volume = {19},
number = {1},
pages = {93},
}