Interfacial reaction between the electroless nickel immersion gold substrate and Sn-based solders

Ruihong Zhang, Ran Zhao, Fu Guo, Zhidong Xia. Interfacial reaction between the electroless nickel immersion gold substrate and Sn-based solders. Microelectronics Reliability, 49(3):303-309, 2009. [doi]

Authors

Ruihong Zhang

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Ran Zhao

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Fu Guo

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Zhidong Xia

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