Ruihong Zhang, Ran Zhao, Fu Guo, Zhidong Xia. Interfacial reaction between the electroless nickel immersion gold substrate and Sn-based solders. Microelectronics Reliability, 49(3):303-309, 2009. [doi]
@article{ZhangZGX09,
title = {Interfacial reaction between the electroless nickel immersion gold substrate and Sn-based solders},
author = {Ruihong Zhang and Ran Zhao and Fu Guo and Zhidong Xia},
year = {2009},
doi = {10.1016/j.microrel.2008.12.016},
url = {http://dx.doi.org/10.1016/j.microrel.2008.12.016},
tags = {rule-based},
researchr = {https://researchr.org/publication/ZhangZGX09},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {49},
number = {3},
pages = {303-309},
}