Xueyan Zhao, Shijian Chen, Yihang Qiu, Jiangkao Li, Zhipeng Huang 0009, Biwei Xie, Xingquan Li, Yungang Bao. iPL-3D: A Novel Bilevel Programming Model for Die-to-Die Placement. In IEEE/ACM International Conference on Computer Aided Design, ICCAD 2023, San Francisco, CA, USA, October 28 - Nov. 2, 2023. pages 1-9, IEEE, 2023. [doi]
@inproceedings{ZhaoCQLHXLB23,
title = {iPL-3D: A Novel Bilevel Programming Model for Die-to-Die Placement},
author = {Xueyan Zhao and Shijian Chen and Yihang Qiu and Jiangkao Li and Zhipeng Huang 0009 and Biwei Xie and Xingquan Li and Yungang Bao},
year = {2023},
doi = {10.1109/ICCAD57390.2023.10323811},
url = {https://doi.org/10.1109/ICCAD57390.2023.10323811},
researchr = {https://researchr.org/publication/ZhaoCQLHXLB23},
cites = {0},
citedby = {0},
pages = {1-9},
booktitle = {IEEE/ACM International Conference on Computer Aided Design, ICCAD 2023, San Francisco, CA, USA, October 28 - Nov. 2, 2023},
publisher = {IEEE},
isbn = {979-8-3503-2225-5},
}