iPL-3D: A Novel Bilevel Programming Model for Die-to-Die Placement

Xueyan Zhao, Shijian Chen, Yihang Qiu, Jiangkao Li, Zhipeng Huang 0009, Biwei Xie, Xingquan Li, Yungang Bao. iPL-3D: A Novel Bilevel Programming Model for Die-to-Die Placement. In IEEE/ACM International Conference on Computer Aided Design, ICCAD 2023, San Francisco, CA, USA, October 28 - Nov. 2, 2023. pages 1-9, IEEE, 2023. [doi]

Abstract

Abstract is missing.