A TSV alignment design for multilayer 3D IC

Wei Zhao, Ligang Hou, Xiaohong Peng, Jinhui Wang, Jingyan Fu, Yang Yang. A TSV alignment design for multilayer 3D IC. In 2015 IEEE 11th International Conference on ASIC, ASICON 2015, Chengdu, China, November 3-6, 2015. pages 1-4, IEEE, 2015. [doi]

Abstract

Abstract is missing.