TSV Assignment of Thermal and Wirelength Optimization for 3D-IC Routing

Yi Zhao, Cong Hao, Takeshi Yoshimura. TSV Assignment of Thermal and Wirelength Optimization for 3D-IC Routing. In 28th International Symposium on Power and Timing Modeling, Optimization and Simulation, PATMOS 2018, Platja d'Aro, Spain, July 2-4, 2018. pages 155-162, IEEE, 2018. [doi]

Abstract

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