Dan Zhao, Ronghua Huang, Tomokazu Yoneda, Hideo Fujiwara. Power-Aware Multi-Frequency Heterogeneous SoC Test Framework Design with Floor-Ceiling Packing. In International Symposium on Circuits and Systems (ISCAS 2007), 27-20 May 2007, New Orleans, Louisiana, USA. pages 2942-2945, IEEE, 2007. [doi]
Abstract is missing.