Xin Zhao, Michael Scheuermann, Sung Kyu Lim. Analysis of DC current crowding in through-silicon-vias and its impact on power integrity in 3D ICs. In Patrick Groeneveld, Donatella Sciuto, Soha Hassoun, editors, The 49th Annual Design Automation Conference 2012, DAC '12, San Francisco, CA, USA, June 3-7, 2012. pages 157-162, ACM, 2012. [doi]
Abstract is missing.