Hengyang Zhao, Sheldon X.-D. Tan. Multi-physics-based FEM analysis for post-voiding analysis of electromigration failure effects. In Iris Bahar, editor, Proceedings of the International Conference on Computer-Aided Design, ICCAD 2018, San Diego, CA, USA, November 05-08, 2018. pages 124, ACM, 2018. [doi]
Abstract is missing.