Xin Zhao, Yang Wan, Michael Scheuermann, Sung Kyu Lim. Transient modeling of TSV-wire electromigration and lifetime analysis of power distribution network for 3D ICs. In Jörg Henkel, editor, The IEEE/ACM International Conference on Computer-Aided Design, ICCAD'13, San Jose, CA, USA, November 18-21, 2013. pages 363-370, IEEE/ACM, 2013. [doi]
@inproceedings{ZhaoWSL13, title = {Transient modeling of TSV-wire electromigration and lifetime analysis of power distribution network for 3D ICs}, author = {Xin Zhao and Yang Wan and Michael Scheuermann and Sung Kyu Lim}, year = {2013}, url = {http://dl.acm.org/citation.cfm?id=2561902}, researchr = {https://researchr.org/publication/ZhaoWSL13}, cites = {0}, citedby = {0}, pages = {363-370}, booktitle = {The IEEE/ACM International Conference on Computer-Aided Design, ICCAD'13, San Jose, CA, USA, November 18-21, 2013}, editor = {Jörg Henkel}, publisher = {IEEE/ACM}, isbn = {978-1-4799-1069-4}, }