Xin Zhao, Yang Wan, Michael Scheuermann, Sung Kyu Lim. Transient modeling of TSV-wire electromigration and lifetime analysis of power distribution network for 3D ICs. In Jörg Henkel, editor, The IEEE/ACM International Conference on Computer-Aided Design, ICCAD'13, San Jose, CA, USA, November 18-21, 2013. pages 363-370, IEEE/ACM, 2013. [doi]
Abstract is missing.